HR 600/3P

Precise: automatic rework for extremely fine and small components up to 01005

Desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components up to 01005.
  • High-precision axis system (X, Y, Z) and high-resolution cameras
  • Automated component placement as well as soldering and desoldering processes
  • Hybrid heating head with two heating zones
  • Large-area, powerful IR underheater in three zones
  • Non-contact temperature measurement with digital sensor
  • Three K-type thermocouple inputs for Accu-TC sensor
  • Effective component cooling with compressed air
Dimensions (W x D x H) in mm850 x 660 x 573
Weight in kg65
Antistatic Design (y/n)yes
Power Rating in W3,200
Nominal voltage in V AC220 V - 240 VAC, 50-60 Hz, 16 A
Upper heatingHybrid spotlight 800 W, in two zones, 60 x 60 mm
Lower heatingIR emitter (3x 800 W), 380 x 250 mm
Measuring channels3x K-Typ, 1x IRS
Position laserClass II
PCB size in mmup to 390 x 300 mm (+x)
up to 535 x 300 mm (+x) (0HR600/3PL)a
Component size in mmChip 01005 up to 50 x 50 mm
Placement accuracy in mmup to +/- 20 µm
Placement camera, upper5 MP GigE colour camera
Component camera, lower5 MP GigE black-and-white camera
Michal Duda Sales Manager
(soldering equipment, devices)
mobile
+420 724 018 761
phone
+420 571 669 312
email
m.duda%a-t%pbt.cz

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HR 600/3P