HR 600/2

Hybrid Rework System - automatic desoldering, placement and soldering of SMT components

Automatic repair process: Desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of up to 1 x 1 mm.

New definition of board repair - automatic, flexible and process reliable!

Highly efficient 800 W hybrid heating head
Homogeneous, large-area IR bottom heating with 3 heating zones (800 W each)
Automatic and precise component alignment with the help of machine vision
Highly accurate, motor-driven axis system for component placement (+/- 0.025 mm)
User independent, reproducible repair results guaranteed
Process control and documentation via the operator software HRSoft
Fully automatic or semiautomatic operation
Suitable for the use of the Dip&Print Station
Version HR 600/2 VOIDLESS upon request!

Parameters and specifications

Dimensions (W x D x H) in mm850 x 660 x 620
Weight in kg57
Antistatic Design (y/n)y
Power Rating in W3,200
Nominal voltage in V AC230
Compressed air connection6-10 bar (free of oil), 1/4 inch quick bar connect
Upper heatingHybrid emitter (2 x 400 W), 60 x 60 mm
Lower heatingIR emitter (3 x 800 W), 380 x 250 mm
PCB size in mmfrom 20 x 20 to 390 x 285 (+x)
Component size in mmfrom 1 x 1 to 50 x 50
OperationWindows PC
Test symbol CE
Optionreflow process camera: 10 MP CMOS USB color camera
lighting: 2x LED point light source, dimmable

Michal Duda Sales Manager
(soldering equipment, devices)