VERSAPRINT 2 ULTRA3

Stencil printer and 3D-SPI in one system with latest measurement technology

3D-SPI for inspection of complex boards directly after printing process
Detect defects through stencil inspection before they occur
  • Zero point measurements of unprinted PCB any time before printing 
  • Integrated closed-loop function for print offset
  • End-to-end software platform for printing and inspection
  • Maintenance and servicing for one machine, one contact for both processes
  • Less space required in production line
Michal Duda Sales Manager
(soldering equipment, devices)
mobile
+420 724 018 761
email
m.duda%a-t%pbt.cz

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