SpectorBox X1

3D Direct Volume Measurement of Solder Joints & Pin Height

The Mek SpectorBOX modular AOI platform is expertly designed for inspecting Wave & Selective Soldering in both through-hole (THT) and surface mount (SMT) components on Printed Circuit Boards (PCBs). It seamlessly integrates with conveyor systems, allowing for efficient inspections within solder frames.

In THT assembly lines, where custom-built solutions and handling systems for dedicated products are the norm, standard SMT AOI machines fall short due to size, weight, clearance, and environmental conditions. Mek’s modular platform offers a customizable solution, making it adaptable to your unique production environment. Many integrators have already successfully incorporated Mek’s modular AOI into complex THT production lines.

Complementing the SpectorBOX is the Mek VeriSpector AOI,  which provides manual assembly guidance and inspection, creating a comprehensive THT inspection solution for the entire assembly process. Mek’s Catch system streamlines the transfer of inspection data for repair, statistical process control (SPC), monitoring, and communication with Manufacturing Execution Systems (MES), managed by IT departments beyond the factory floor.
  • 3D direct volumetric measurements of solder joints
    Pin height measurements
    Shape analysis of solder joints
    Press-Fit penetration inspection
    Effective high-gloss solder reflection suppression enhancing repeatability and reliability
    Minimal shadow effects from tall components enhancing repeatability and reliability
    High-clearance over 150mm (5.9″) on the THT components side
    High-clearance over 100mm (3.9″) on the THT solder side for use under various conveyer systems
    60mm Z-axis for inspecting at different heights
Václav Fiurášek Sales Manager
(inspection, measurement)
+420 602 579 951

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SpectorBox X1