F3+ solder paste series provides a full range of Pb-free and Pb containing solder alloys to be used with this flux technology.

F3+ is a halide-free, no-clean solder paste with a long stencil life and high tack force. Standard available alloys are S62, SN100C, SAC305 and SCANGe. The SCANGe alloys have a melting range of 8°-11°C, which provides extremely good anti-tombstoning behavior. The low levels of Ag (compared to the SAC305 alloy) combined with the micro additions of Ni and Ge result in fine grain structures and stabilizes Inter Metallic Compounds (IMC).

The same flux technology is used for both Pb-free and SnPb alloys, which makes qualifications easier.
  • ​According to J-STD-004: ROL0
  • Halogen- and halide-free
  • RoHS compliant: SN100C®,SAC305, SCAN-Ge
  • Available with S62 and S63
  • Excellent wetting performance
  • No-Clean
  • Clear residues
  • High SIR values
  • alloy SnCu0.7Ag1.0NiGe
  • Wide melting range alloy to reduce tombstoning problems 217°C - 224°C
  • REL0
  • Improved properties by micro alloying with nickel and germanium
  • Improved wetting by the low silver content
  • Reduced intermetallic layer growth by nickel
  • Reduced copper leaching by nickel and germanium
  • Fine grained micro structure by nickel
David Pisárik Sales Manager
(soldering materials)
+420 725 404 124

Send me your question.

Your personal data will be processed according to the privacy policy.