HR 550 XL

Large and flexible: guided rework for large boards up to 530 x 530 mm

Desoldering, placement and soldering of all types of surface mounted devices (SMD) - up to 70 x 70 mm: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of min. 0.2 x 0.4 mm.
  • 1,900 W high-performance hybrid heating element
  • Full-surface 6,400 W IR underheater
  • High-resolution cameras for placement and process monitoring
  • Computer-aided component alignment, digital split optics
  • Ergonomically optimal system operation
  • Modern, user-friendly operating softwareDimensions (W x D x H) in mm755 x 930 x 545/747
Weight in kg102 kg including control unit
Antistatic Design (y/n)yes
Power Rating in W8,200
Nominal voltage in V AC3× 400 VAC, 50-60 Hz, 16 A
Upper heatingHybrid radiator 900 W infrared + 900 W hot air, 70 × 70 mm
Lower heatingIR emitter (8 × 800 W), 530 × 530 mm
Measuring channels3x K-type, 1 × IRS
Position laserClass II
PCB size in mmup to 530 x 610 mm (+x)
Component size in mmfrom 0,5 × 0,5 up to 70 × 70 mm
Michal Duda Sales Manager
(soldering equipment, devices)
mobile
+420 724 018 761
phone
+420 571 669 312
email
m.duda%a-t%pbt.cz

Send me your question.

Your personal data will be processed according to the privacy policy.
  • New
HR 550 XL