Inline reflow soldering with vacuum
Today, convection reflow soldering is the preferred joining technique in the surface mounting of electronic assemblies. Combined with component development, it achieves the inexorably growing integration density in mobile devices, among others.
With the EXOS 10/26, Ersa presents a convection reflow soldering system with 22 heating and four cooling zones as well as a vacuum chamber after the peak zone, with which the void rate can be reduced by 99%. This is achieved by relying on technologies proven thousands of times in HOTFLOW models, such as heating and cooling zones or the intuitive, award-winning interface.
Thanks to intelligent features, the Ersa reflow soldering system produces particularly economically and void-free. In addition to process reliability, the EXOS is particularly easy to maintain. For energy-efficient cooling, three expansion stages are available for the EXOS (a maximum of four cooling zones at the top and bottom), so that optimum cooling gradients can be set for all requirements.