VAC745/765

The VAC 745/765 (available as batch or inline) combines the advantages of the vapor phase with the vacuum process and guarantees void-free solder joints with highest quality.

The soldering systemoperates in a completely inert atmosphere during the whole reflow and vacuum process. Manypatented features are available and provide a wide range of flexibility. The machine promises oxygenfree soldering an no overheating of components. In addition, the power consumption of the machine is very low.

Parameters and specifications

Void-free solder joints with highest quality
Inert atmosphere during the whole reflow and vacuum process
Wide variety of adjustable solder profiles
Low medium consumption due to 2-chamber design and medium recovery
Temperature recording and profiling with 4 integrated channels
Permanent data collection
Medium level check and automatic medium filtering
Integrated cooling fan
Automatic monitoring of vacuum process
Maintenance-free transport system (patented)

	VAC745	VAC745i	VAC765	VAC765i
Length	1355 mm	2040 mm	1355 mm	2040 mm
Depth	2400 mm	3040 mm	2810 mm	3450 mm
Hight	1470 mm	1470 mm	1470 mm	1470 mm
Weight	1030 kg	1290 kg	1200 kg	1450 kg
Loading/unloading level		900 - 1000 mm		900 - 1000 mm
Medium agent filling	40 kg	40 kg	60 kg	60 kg