VAC745/765

The VAC 745/765 (available as batch or inline) combines the advantages of the vapor phase with the vacuum process and guarantees void-free solder joints with highest quality.

The soldering systemoperates in a completely inert atmosphere during the whole reflow and vacuum process. Manypatented features are available and provide a wide range of flexibility. The machine promises oxygenfree soldering an no overheating of components. In addition, the power consumption of the machine is very low.
  • Void-free solder joints with highest quality
  • Inert atmosphere during the whole reflow and vacuum process
  • Wide variety of adjustable solder profiles
  • Low medium consumption due to 2-chamber design and medium recovery
  • Temperature recording and profiling with 4 integrated channels
  • Permanent data collection
  • Medium level check and automatic medium filtering
  • Integrated cooling fan
  • Automatic monitoring of vacuum process
  • Maintenance-free transport system (patented)
  VAC745 VAC745i VAC765 VAC765i
Length 1355 mm 2040 mm 1355 mm 2040 mm
Depth 2400 mm 3040 mm 2810 mm 3450 mm
Hight 1470 mm 1470 mm 1470 mm 1470 mm
Weight 1030 kg 1290 kg 1200 kg 1450 kg
Loading/unloading level   900 - 1000 mm   900 - 1000 mm
Medium agent filling 40 kg 40 kg 60 kg 60 kg
Jaroslav Sladký Head of Sales Department (machines)
mobile
+420 606 754 653
phone
+420 571 669 315
email
j.sladky%a-t%pbt.cz

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