The VERSAFLOW 3/45 is the first in-line selective soldering machine with dual track transport. Highest flexibility and highest throughput can be realised with the smallest possible required space.
In order to satisfy all demands in regards to flexibility, the third generation of Ersa´s VERSAFLOW selective soldering systems is based on a modular platform. Depending on the application and on the throughput requirements called for, additional flux, preheat and solder modules can be integrated into the system. In the maximum configuration level of the VERSAFLOW, the system can therefore operate with up to three solder modules, and each of these modules can again be configured with two mini-wave solder baths. In total, up to 6 mini-wave solder bath can be installed in a system, and each solder module can be preceded by a preheat unit.
Doubling the throughput rate, maximum expansion
Multi-wave solder bath is available as an alternative to the single-wave bath. For configurations with the single-wave bath, additional top side preheaters are available for both the preheat zones as well as over the solder baths. With the dual-track option, the throughput rate can be doubled without increasing the footprint of the unit. If the size of the board assembly permits, the preheaters can be segmented, and this feature will further increase throughput. The VERSAFLOW offers its user a maximum of opportunities to configure his system. On account of the high throughput, the amortization period is rather short. With the Ersa VERSAFLOW, the highest throughput rate of any system currently on the market is achieved.