HR 600XL

Hybrid Rework System - automatic rework on large assemblies

Rework especially on large board applications up tp 625 × 625 mm (24.5 × 24.5 inch). Desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of up to 0.5 x 0.5 mm.

Highly efficient 800 W hybrid heating head
Large-area IR Matrix bottom heater with 25 single heating elements (600 W each)
Process observation with up to 8 thermocouples
Automatic and precise component alignment with the help of machine vision
Highly accurate, motor-driven axis system for component placement (+/- 0.025 mm)
User independent, reproducible repair results guaranteed
Process control and documentation via the operator software HRSoft 2
Fully automatic or semiautomatic operation
Suitable for the use of the Dip&Print Station

Parameters and specifications

Dimensions (W x D x H)2250 × 1700 × 1650 mm incl. Monitor holder
Weight in kgapprox. 600
Antistatic Design (y/n)y
Power Rating in W16,000
Nominal voltage in V AC400, 3 phase, 50/60 Hz, 30 A
Compressed air connection6-10 bar (free of oil), 1/4 inch quick bar connect
Upper heatingHybrid emitter (800 W), 60 x 60 mm
Lower heatingIR emitter (25 x 600 W), 625 x 625 mm
PCB size in mmfrom 20 x 20 to 625 x 625
PCB thicknessup to 10 mm
Component size in mmfrom 0.5 x 0.5 to 60 x 60
OperationWindows PC, HRSoft 2
Test symbolCE

Option - reflow process camera: 5 MP GigE color camera, 25 mm focal width; lighting: 2x LED light source

Michal Duda Sales Manager
(soldering equipment, devices)