HR 550

Powerful Hybrid Rework System, 3.900 W

High precision repair process: Desoldering, placement and soldering of all types of surface mounted devices (SMD) - up to 70 x 70 mm: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of min. 0.2 x 0.4 mm.

GUIDED REWORK!

Highly efficient 1.500 W hybrid heating head
Large-area IR bottom heating in 3 heating zones (2.400 W)
Integrated vacuum pipette for component removal and placement
Highly accurate placement with integrated force sensor
Enhanced Visual Assistant (EVA)
Computer aided component placement
Process control and documentation via software HRSoft 2
Suitable for the use of the Dip&Print Station

Parameters and specifications

Dimensions (W x D x H) in mm 573 x 765 x 545/747 (heating head down/up)
Weight in kg76
Antistatic Design (y/n)y
Power Rating in W3,900
Nominal voltage in V AC230
Upper heatingHybrid emitter (900 + 600 W), 70 x 70 mm
Lower heatingIR emitter (3 x 800 W), 390 x 270 mm
PCB size in mmfrom 20 x 20 to 382 x 300 (+x)
Component size in mmfrom 0.5 x 0.5 to 70 x 70
OperationWindows PC
Test symbolCE

Michal Duda Sales Manager
(soldering equipment, devices)