HR 550

Powerful Hybrid Rework System, 3.900 W

High precision repair process: Desoldering, placement and soldering of all types of surface mounted devices (SMD) - up to 70 x 70 mm: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of min. 0.2 x 0.4 mm.

  • Highly efficient 1.500 W hybrid heating head
  • Large-area IR bottom heating in 3 heating zones (2.400 W)
  • Integrated vacuum pipette for component removal and placement
  • Highly accurate placement with integrated force sensor
  • Enhanced Visual Assistant (EVA)
  • Computer aided component placement
  • Process control and documentation via software HRSoft 2
  • Suitable for the use of the Dip&Print Station
Dimensions (W x D x H) in mm 573 x 765 x 545/747 (heating head down/up)
Weight in kg76
Antistatic Design (y/n)y
Power Rating in W3,900
Nominal voltage in V AC230
Upper heatingHybrid emitter (900 + 600 W), 70 x 70 mm
Lower heatingIR emitter (3 x 800 W), 390 x 270 mm
PCB size in mmfrom 20 x 20 to 382 x 300 (+x)
Component size in mmfrom 0.5 x 0.5 to 70 x 70
OperationWindows PC
Test symbolCE
Michal Duda Sales Manager
(soldering equipment, devices)
+420 724 018 761

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HR 550