HR 200

Compact Hybrid Rework System, 400 W (+ 800 W)

Manual repair process:Desoldering and soldering of small and medium size surface mount device (SMD): BGA, QFP, PLCC, MLF and SOIC. The component is manually remoced from the PCB (pincette or vacuum gripper). Previous to soldering the component needs adequate alignment.

Rework out of the box!
Simple and fast desoldering and soldering of SMDs:

Highly efficient, long-life 400 W hybrid heating head
Optional with 800 W IR-bottom heating
Very short soldering times feasibel
Activation with safety foot switch
Operation LEDs on the system
Intuitive operation without software

Parameters and specifications

Dimensions (W x D x H) in mm300 x 300 x 280
Weight in kg3,7
Antistatic Design (y/n)y
Power Rating in W400 + 800
Nominal voltage in V AC230
Upper heatingHybrid emitter 400 W, 30 x 30 mm
Lower heatingIR emitter 800 W, 150 x 150 mm
PCB size in mmfrom 20 x 20 to 215 x 300 (+x)
Component size in mmfrom 1 x 1 to 30 x 30
Test symbolCE

Michal Duda Sales Manager
(soldering equipment, devices)