HR 200

Compact Hybrid Rework System, 400 W (+ 800 W)

Manual repair process:Desoldering and soldering of small and medium size surface mount device (SMD): BGA, QFP, PLCC, MLF and SOIC. The component is manually remoced from the PCB (pincette or vacuum gripper). Previous to soldering the component needs adequate alignment.

Rework out of the box!
Simple and fast desoldering and soldering of SMDs:
  • Highly efficient, long-life 400 W hybrid heating head
  • Optional with 800 W IR-bottom heating
  • Very short soldering times feasibel
  • Activation with safety foot switch
  • Operation LEDs on the system
  • Intuitive operation without software
Dimensions (W x D x H) in mm300 x 300 x 280
Weight in kg3,7
Antistatic Design (y/n)y
Power Rating in W400 + 800
Nominal voltage in V AC230
Upper heatingHybrid emitter 400 W, 30 x 30 mm
Lower heatingIR emitter 800 W, 150 x 150 mm
PCB size in mmfrom 20 x 20 to 215 x 300 (+x)
Component size in mmfrom 1 x 1 to 30 x 30
Test symbolCE
Michal Duda Sales Manager
(soldering equipment, devices)
+420 724 018 761

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