HR 100

Compact Hybrid Rework System, hand-operated or stationary operation

Universal soldering and unsoldering of SMDs Flexible desoldering and soldering of all types of surface mounted devices (SMD), e.g. chips up to 0402 SOIC, MLF, CSP, µBGA, BGA, QFP, PLCC; maximum recommended device size: 20 x 20 mm. Handling of components with Vac Pen or SMD tweezer (not included in the delivery) or for stationary unsoldering with optional vacuum pipette (0IRHP100A-13).

The beginning of professional assembly unit repair:
HR 100 - flexible hybrid rework!

Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering
Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs
Exchangeable hybrid adaptors of various sizes direct up to 200 W of heating energy specifically to the component
No blowing away of neighbouring components
Optionally available with stand, 800 W IR bottom heating and PCB intake
Vac Pen for safe handling of devices
Operation software IRSoft

Parameters and specifications

HR 100 Base Station
Dimensions (W x D x H) in mm211 x 220 x 168
Weight in kg4.5
Antistatic Design (y/n)y
Power Rating in W200
Nominal voltage in V AC230
Upper heating200 W (Hybrid Tool)
Component size in mm1 x 1 bis 20 x 20
OperationOne-touch operating button or Windows PC
Test symbolCE
Hybrid Tool
Length in mmSupply 1,350
Weight in kg0.3
Power Rating in W200
Antistatic Design (y/n)y
HP 100 Heating Plate with Stand
Dimensions (W x D x H) in mm200 x 260 x 53,5
Weight in kg2,5
Antistatic Design (y/n)y
Power Rating in W800
Nominal voltage in V AC230
PCB size in mmfrom 20 x 20 to ~ 290 x 250
Test symbolCE

Michal Duda Sales Manager
(soldering equipment, devices)