Reliable full covection reflow ovens - Compact, Stable, Uniform & Efficient
Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m.
The RO300FC exclusively heats with hot air convection and can be used for the different tasks in SMT assembly, especially for the reflow soldering of lead free solder pastes or the curing of adhesives. It features easy operation, perfect reflow results and a robust construction. It is well suited for continuous production, small batch manufacturing and prototyping.
The vertical hot air stream evenly heats the complete PCB. The high air volume guarantees equal heating rates in all the components and the substrate. This technology eliminates the risk of hot spots or heat shadows. The convection technology applies the same temperature everywhere on the board independent of component size or color, making programming as easy as possible.
The perfect zone separation of the RO300FC allows the setup of profiles for all applications: lead free profile with soak platform, lead free profile without platform, curing profile for adhesives.
Depending on the application a mesh belt or a chain conveyor system is used for substrate transport.
The integrated microprocessor control with LCD display provides an easy-to-use operator interface. The memory includes preset program proposals and offers enough space for own profiles.