MX 70

Mechatronika’s MX70 Pick and Place System is a versatile automatic machine for placing SMD components from 0201 to 40 x 40 mm with a full vision, touchless component centering.

Matured, high quality rigid construction, ease of programming and excellent price to performance ratio make MX70 perfectly suited for small scale production lines and prototyping.

MX70 combines mechanical accuracy with high quality pattern recognition system built into easy to use and powerful programming software. M70 productivity and flexibility, quick change-over and low maintenance requirements drive down total cost of ownership (TCO) to the level demanded by today's cost-sensitive production environments.

The very unique feature of MX70 is its ability to pickup bulk (loose) components from container-type feeders. MX70 built-in intelligent vision system enables to locate required component, pick it up, determine its position on the nozzle head and precisely place it on preprogrammed position. MX70 accepts any number of bulk component feeders that can fit within its working space.
MX70 can be equipped with with the optional glue / solder paste dispensing head.

PCB - Placement area330 × 500 mm
ComponentsRange from 0201 to 40 × 40 mm
 Pitch up to 0.4 mm
Placement accuracyBetter than 0.08 mm
Dimensions750 × 1100 × 1350 mm,
Weight150 kg
Robert Gajdůšek Sales manager
(AOI,Testing, selective laser soldering)
+420 724 512 929

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