IBond5000-Wedge

Klínový poloautomatický kontaktovací systém - wedge bonder.

The IBond5000-Wedge is an advanced wedge bonder used for process development, production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

Micro Point Pro

Parameters and specifications

7” TFT Touch Screen Management
Cortex A9 Dual-Core CPU-based hardware system
Windows CE-based management software
USB connectivity - External Mouse, Keyboard, Disk on Key
Load/Store wire bonding profiles, Disk on Key backup
800MB Capacity
MPP Bonding profiles internal library
On-Line Manual
Analog Pots Kit Optional
Internal Tools database
Semi-automatic/manual mode with Z option
Designed for aluminum wire, gold wire, ribbon and copper
Large 5.3” X 5.3” bonding area
Consistent tail length with fine adjustment on panel
Deep Access capability
Z-axis DC servo motion with closed loop control
Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer
Built-in temperature controller
Wide range of microscopes and optical accessories available
RoHS Compliant
Chessman/Mouse & Manual Z convertible right or Left
Bonding Types: Wedge, Tab, Stitch and Ribbon
Advanced Wedge Automatic Wire Re-Feed

Daniel Striček Head of Sales Department (P&P equipment, production lines, TTC solutions)

mobile: +420 724 890 087
email: d.stricek%a-t%pbt.cz

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Kontakt

Brochure PDF (813 kB)
Spare parts

Micro Point Pro

IBond5000-Wedge