Klínový poloautomatický kontaktovací systém - wedge bonder.

The IBond5000-Wedge is an advanced wedge bonder used for process development, production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.
  • 7” TFT Touch Screen Management
  • Cortex A9 Dual-Core CPU-based hardware system
  • Windows CE-based management software
  • USB connectivity - External Mouse, Keyboard, Disk on Key
  • Load/Store wire bonding profiles, Disk on Key backup
  • 800MB Capacity
  • MPP Bonding profiles internal library
  • On-Line Manual
  • Analog Pots Kit Optional
  • Internal Tools database
  • Semi-automatic/manual mode with Z option
  • Designed for aluminum wire, gold wire, ribbon and copper
  • Large 5.3” X 5.3” bonding area
  • Consistent tail length with fine adjustment on panel
  • Deep Access capability
  • Z-axis DC servo motion with closed loop control
  • Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer
  • Built-in temperature controller
  • Wide range of microscopes and optical accessories available
  • RoHS Compliant
  • Chessman/Mouse & Manual Z convertible right or Left
  • Bonding Types: Wedge, Tab, Stitch and Ribbon
  • Advanced Wedge Automatic Wire Re-Feed
Daniel Striček Head of Sales Department (P&P equipment, production lines, TTC solutions)
+420 724 890 087

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