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IBond5000-Ball

Kuličkový poloautomatický kontaktovací systém - ball bonder

The iBond5000-Ball is an advanced ball bonder used for process development production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every gold ball bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers and much more.
Micro Point Pro
  • 7” TFT Touch Screen Management
  • Cortex A9 Dual-Core CPU-based hardware system
  • Windows CE-based management software
  • USB connectivity - External Mouse, Keyboard, Disk on Key
  • Load/Store wire bonding profiles, Disk on Key backup
  • 800MB Capacity
  • MPP Bonding profiles internal library
  • On-Line Manual
  • Analog Pots Kit Optional
  • Internal Tools database
  • Semi-automatic/manual mode with Z option
  • Consistent ball size via Negative Electronic Flame-Off
  • Missing ball detection and auto-stop
  • Large 6” X 6” bonding area
  • Consistent tail length with fine adjustment on operator panel
  • Deep access capability
  • Z axis DC servo motion with closed loop control
  • Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer
  • Built-in temperature controller
  • Various microscope and spotlight targeting options available
  • Variety of wire types: Gold and Copper (with Copper kit option)
  • Chessman/Mouse & Manual Z convertible Right & Left Ball bonding, Bumping, Coining, Security Bond and Tab
Daniel Striček Head of Sales Department (P&P equipment, production lines, TTC solutions)
mobile
+420 724 890 087
email
d.stricek%a-t%pbt.cz

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Micro Point Pro
IBond5000-Ball