ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput.

ADT 8030 is a high accuracy system that can dice products up to 12” in diameter or 12” × 12” product,  at high performances and low cost of operation.
  • Bridge type frame
  • Flexibility - Supports Hub and Hubless blades up to 3” O.D.
  • Dual microscopes, fixed non-contact sensors and two dress stations
  • Spindles of 1.8 KW or 2.2 KW high power (for challenging applications)
  • Superior vision system with continuous zoom magnification
  • Intuitive operation interface using a large 19” touch screen monitor
  • Highest dicing process speeds - Lowest cost
  • Support up to 12” × 12” square products
  • Industrial PC based on Win 10 OS
  • Air bearing feed axis (X)
  • Fast & Simple blade change with a spindle shaft lock mechanism
  • Fast automatic alignment and cut positioning for increased throughput
  • Automatic Kerf inspection and quality analysis for maximum precision
  • Process data logging and statistical analysis
  • SECS / GEM platform ready
  • Load port ready for factory automation
  • All electronic on top of the cut chamber
Daniel Striček Sales Manager
(X-Ray, CT, SMT P&P equipment)
+420 724 890 087

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