8020
Fully Automatic Twin Dicing System
The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation.
Leading Applications
- Silicon wafers / discrete devices
- Silicon carbide (SiC)
- MEMS
- SAW devices
- Glass wafer
- Packaging (QFN, LED…)