Fully Automatic Twin Dicing System

The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation.

Leading Applications
  •   Silicon wafers / discrete devices
  •   Silicon carbide (SiC)
  •   MEMS
  •   SAW devices
  •   Glass wafer
  •   Packaging (QFN, LED…)
Features and Benefits
  •  Flexibility - Supports Hub and Hubless blades up to 3" O.D.
  •  Spindles of 1.8 kW or 2.4 kW high power (for challenging applications)
  •  Superior vision system with continuous zoom magnification
  •  Intuitive operation interface using a large 19” touch screen monitor
other key feautures
  •  Air bearing feed axis (X)
  • Fast automatic alignment and cut positioning for increased throughput
  •  Automatic Kerf inspection and quality analysis for maximum precision
  •  Process data logging and statistical analysis 
  •  Fast & Simple Blade Change with a locking spindle shaft
  •  SECS/GEM platform ready
  •  Full access to all areas of the system for convenient and easy maintenance
Daniel Striček Sales Manager
(X-Ray, CT, SMT P&P equipment)
+420 724 890 087

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