8020

Fully Automatic Twin Dicing System

The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation.

Leading Applications

•   Silicon wafers / discrete devices
•   Silicon carbide (SiC)
•   MEMS
•   SAW devices
•   Glass wafer
•   Packaging (QFN, LED…)