7220
Fully automatic Dicing Sytems.
With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications:
- Silicon
- Glass on Silicon
- MEMS
- GaAs wafers
- Package Singulation (BGA & QFN)
- LTCC
- PCB
- Hard Materials
The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.