7220

Fully automatic Dicing Sytems.

With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications:

Silicon
Glass on Silicon
MEMS
GaAs wafers
Package Singulation (BGA & QFN)
LTCC
PCB
Hard Materials

The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.

Parameters and specifications

Unique Wx3 wafer handling system streamlines wafer flow for greater productivity
Continuous digital magnification vision System provides optimal magnification for any eye-point
Special agorithm predicts blade wear rates to reduce height measurement time and increase UPH
Touch panel display supports a user-friendly graphical interface (GUI)
Atomized wafer cleaning technology for superior process results
Dedicated dressing cassette enables automatic blade dressing
Built-in Inspection tray allows for in-process quality assessment
Unique multi-panel processing capabilities
Small footprint
Optional: Dressing Station for diamonds exposure and clogging prevention