7120/7130

The 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.

With different models to choose from, each optimized for a specific range of applications, the 7120 / 7130 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available

The 7120 / 7130 Dicing System is an industry leading platform designed for a variety of applications such as: 
  • Ceramic Substrates & Capacitors
  • Automotive Sensors 
  • Glass on Silicon
  • Package Singulation (BGA, QFN)
  • SAW Filters
  • LTCC
  • Glass
  • PZT
  • LED & LED on PCB Packages
  • Opto-electronic Components
  • Sensors & MEMS
  • IC Wafers
  • Extra Large Area Dicing (7100 XLA)
  • Large Area
  • Tilting Spindle 
  • Dressing Station for diamonds exposure and clogging prevention
  • 2” and 4” spindle dicing systems
  • A full range of automatic vision capabilities
  • Advanced hardware platform for high reliability and low maintenance
  • Heavy Duty, cast-iron base structure for superior precision and accuracy
  • Increased yield, throughput and process control
  • Unique multi-panel processing capabilities
  • Special blade wear forecast algorithm
  • User-friendly software platform
 
Model 7122 7132 7124 7134
Workplece Size 200 × 200 mm max. 300 × 300 mm max. 200 × 200 mm max. 300 × 300 mm max.
Blade Size 2" - 3"   4" - 5"  
Spindle max. 60.000 ot/min   max. 30.000 ot/min  
Daniel Striček Sales Manager
(X-Ray, CT, SMT P&P equipment)
mobile
+420 724 890 087
phone
+420 571 669 349
email
d.stricek%a-t%pbt.cz

Send me your question.

Your personal data will be processed according to the privacy policy.