7120/7130

The 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.

With different models to choose from, each optimized for a specific range of applications, the 7120 / 7130 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available

The 7120 / 7130 Dicing System is an industry leading platform designed for a variety of applications such as:

Ceramic Substrates & Capacitors
Automotive Sensors
Glass on Silicon
Package Singulation (BGA, QFN)
SAW Filters
LTCC
Glass
PZT
LED & LED on PCB Packages
Opto-electronic Components
Sensors & MEMS
IC Wafers

Parameters and specifications

Extra Large Area Dicing (7100 XLA)
Large Area
Tilting Spindle
Dressing Station for diamonds exposure and clogging prevention
2” and 4” spindle dicing systems
A full range of automatic vision capabilities
Advanced hardware platform for high reliability and low maintenance
Heavy Duty, cast-iron base structure for superior precision and accuracy
Increased yield, throughput and process control
Unique multi-panel processing capabilities
Special blade wear forecast algorithm
User-friendly software platform

Model	7122	7132	7124	7134
Workplece Size	200 × 200 mm max.	300 × 300 mm max.	200 × 200 mm max.	300 × 300 mm max.
Blade Size	2" - 3"		4" - 5"
Spindle	max. 60.000 ot/min		max. 30.000 ot/min