microme|x

The phoenix microme|x is a high-resolution 180 kV microfocus X-ray inspection system for real time inspection of solder joints and electronic components as well as for automated inspection (µAXI).

Innovative and unique features and an extreme high positioning accuracy make the system the effective and reliable solution for a wide spectrum of 2D and 3D inspection tasks: R&D, failure analysis, process and quality control as well as automated offline inspection. Optional the system can be equipped with CT or planarCT.
 
  • Extremely high defect coverage and repeatability
  • Outstanding ease-of-use
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window as a new standard
  • Combined 2D / 3D CT operation
  • 180 kV / 20 W high-power microfocus tube with up to 0,5 µm detail detectability
  • Brilliant live images by high dynamic temperature-stabilized GE DXR digital detector with 30 fps (frames per second)
  • x|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
  • Precise manipulation
  • 3D computed tomography scans within 10 seconds (optional)
  • Optional offset|scan capability to scan bigger parts or the same size parts with higher resolution
  • Advanced planarCT option for slice or multislice package evaluation without overaying structures
Daniel Striček Sales Manager (X-Ray, CT, SMT P&P equipment)
mobile
+420 724 890 087
phone
+420 571 669 349
email
d.stricek%a-t%pbt.cz

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