iX7059 PCB Inspection

3D X-ray inspection for high-density and double-sided PCB assemblies at the highest level

With its iX7059 product line, Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards. Outstanding inspection performance for SMD and THT solder joints as well as exact measurement of voids deliver 100% quality assurance in modern SMT production, so that hidden defects can be detected even when complex assemblies cause massive shadowing effects.

In addition to traditional SMD inspection, the compact iX7059 PCB Inspection or iX7059 PCB Inspection XL 3D AXI system also provides high-precision, reliable inspection of soldering defects such as head-in-pillow and pores in BGA and LGA components. Cutting-edge, powerful microfocus X-ray technology, new dynamic 3D image acquisition methods and seamless handling guarantee the best throughput rates.

The iX7059 PCB Inspection XL with extended longboard option comes into play for especially large PCB assemblies measuring up to 1,400 mm – this solution is ideal for server boards, LEDs, semiconductors and 5G electronics.

Parameters and specifications

Seamless, perfect handling of PCB assemblies – even for very large PCBs measuring up to 1,400 mm
Powerful X-rays with 130 kV or optionally 160 kV
Unbeatably fast dynamic image acquisition concept Evolution 4 or optionally 5 for even more speed and the highest throughput
High-precision inspection in 2D, 2.5D and 3D
High-quality 3D AXI volume calculation with planar CT
Additional vertical slices for optimum analyses and dependable verification
Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
Maximum inspection program optimization through integrated verification

DIMENSIONS
System housing:	1,493 mm x 1,654 mm x 2,207 mm (W x H x D)
X-RAY TECHNOLOGY
X-ray tube:	Sealed microfocus X-ray tube
High voltage:	130 kV (up to 180 kV optional)
Detector:	Flat panel detectors type FPD T2 (T3 optional) (T4 optional), 14-bit grayscale value depth
Resolution:	8.5 – 25 µm/pixel
INSPECTION
Inspection procedure:	2D, 2.5D, 3D
HANDLING
	iX7059 PCB Inspection	iX7059 PCB Inspection XL
Inspection object dimensions:	up to 610 x 600 mm* (L x W)	up to 1,400 x 660 mm* (L x W)
Inspection object weight:	up to 10 kg	up to 15 kg
SOFTWARE
User interface:	Viscom vVision/EasyPro