iX7059 Module Inspection

High process efficiency through 3D X-ray and integrated CT

For manufacturers of power semiconductors, such as IGBT modules and SiC chips, compliance with safety and performance requirements is essential. The quality of each individual solder connection of the components ultimately determines whether overheating and thus failure will occur. The new iX7059 Module Inspection offers seamless and reliable quality assurance for this purpose. The fully automatic 3D X-ray system with integrated computed tomography is distinguished by easy-to-classify, accurate layer inspection images and a large inspection scope.

The X-ray system offers flawless handling of frame-based power modules or components on workpiece carriers. The iX7059 Module Inspection is compact and can be easily integrated into a line. There it fulfills - intelligently networked - all smart factory requirements.

Parameters and specifications

Precise solder joint inspection for IGBT modules and SIC chips
Intelligent checking of voids for flawless heat dissipation
Easy to classify, accurate layer test images
Fast handling of workpiece carriers and solder frames for maximum throughput
Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
Maximum inspection program optimization through integrated verification
Additional vertical slices for optimum analyses and dependable verification
High-quality 3D AXI volume calculation with planar CT

DIMENSIONS
System housing:	1493 mm x 1654 mm x 2207 mm (W x H x D)
X-RAY TECHNOLOGY
X-ray tube:	Sealed microfocus X-ray tube
High voltage:	130 kV (up to 180 kV optional)
Detector:	Type T2 FDP flat panel detector (T3 optional), 14-bit grayscale depth
Resolution:	9.5 - 25 μm/pixel
HANDLING
Inspection object size:	Up to 1000 mm x 660 mm (L x W)*
Inspection object weight:	Up to 15 kg
SOFTWARE
User interface:	Viscom vVision/EasyPro