Inspection systems for the fast inspection of hidden solder joints

Extreme flexibility due to seven movement axes for the inspection of BGA, µBGA, CSP, Flip Chip, CGA and throughput for THT connections. Enables the evaluation of heel filling for QFP, SOIC and other components with gull wing connections, wetting length and inner wetting for PLCC and other components with J connections.

The most various viewing angles through tilting, rotating, inclining - even in case of large rebuilding by neighbouring components! The wide angle view enables the inspection of VIA walls, sockets etc. without tilting the optics (through the shift method)! Consistently create sharp images from several individual images with various focus settings using the ImageDoc v3 EXP FocusFusion function (option)!
  • Inspection systems with two quick change lenses:
    - 90° BGA optics (approx. 280 µm clearance)
    - 0° MACROZOOM top view optics
  • Fast, stationary inspection of hidden solder joints
  • Integrated, dimmable LED lighting or external LED light source with goose neck fibre light and light brush
  • 5 Megapixel N-MOS colour camera with USB connection
  • Ideal for stationary inspection
  • Including Ersa ImageDoc v3 inspection software (basic version)
Michal Duda Sales Manager
(soldering equipment, devices)
+420 724 018 761

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