High quality BGA inspection system for BGA, µBGA, CSP, Flip Chip and other hidden solder joints

High flexibility due to six movement axes for the inspection of BGA, µBGA, CSP, Flip Chip, CGA and throughput for THT connections. Enables the evaluation of heel filling for QFP, SOIC and other components with gull wing connections, wetting length and inner wetting for PLCC and other components with J connections. The most various viewing angles through tilting, rotating, inclining - even in case of large rebuilding by neighbouring components! The wide angle view enables the inspection of VIA walls, sockets etc. through the shift method! Consistently create sharp images from several individual images with various focus settings using the ImageDoc v3 EXP FocusFusion function (option)!
  • Original ERSASCOPE endoscope inspection optics with 90° prism beam deflection (approx. 300 µm clearance)
  • 6 Movement axes for flexible adjustment to practically every required viewing angle
  • High-performance, dimmable LED lighting in daylight colour
  • High quality WVGA CMOS colour camera with USB connection
  • XY table with fine adjust wheels, freely positionable under the optics
  • Flexible light management:
    - inspection head with fibre optic stereo front light
    - mechanically coupled, swivelling backlight 
    - fibre optic gooseneck for targeted lighting from all sies
Michal Duda Sales Manager
(soldering equipment, devices)
+420 724 018 761
+420 571 669 312

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