Ersa Mobile Scope

Hand-operated inspection system for the fast inspection of hidden solder joints

High flexibility and speed due to hand-operated inspection of BGA, µBGA, CSP, Flip Chip, CGA and throughput for THT connections. Enables the evaluation of heel filling for QFP, SOIC and other components with gull wing connections, wetting length and inner wetting for PLCC and other components with J connections.

The most various viewing angles through tilting, rotating, inclining - even in case of large rebuilding by neighbouring components! The wide angle view enables the inspection of VIA walls, sockets etc. without tilting the optics (through the shift method)! Consistently create sharp images from several individual images with various focus settings using the ImageDoc v3 EXP FocusFusion function (option, stand is required)!

Parameters and specifications

Mobile inspection system with two quick change lenses (depending on equipment):
- 90° BGA optics (approx. 280 µm clearance)
- 0° MACROZOOM top view optics
Fast, hand-operated inspection of hidden solder joints
Integrated, dimmable LED lighting
2 Megapixel N-MOS colour camera with USB connection
Including additional LED fibre light for BGA optics
Ideal for inspection of continuously changing locations and for service
Including Ersa ImageDoc v3 inspection software (basic version)