S6053BO-V

Reliable 2D and 3D Wire Bond Inspection

The smaller the inspection objects, the more important precision and repeat accuracy are in the inspection. Manufacturers of high-end electronics who place special requirements on the safety of their products rely on these factors in particular. The Viscom S6053BO-V system gives you this certainty by combining the latest 3D measuring technology methods with long-standing experience in wire bond inspection.

Additional sophisticated imaging developments are available for highly reflective wires, in addition to the familiar fringe projectors, guaranteeing reliable quality assurance in the bond process. Viscom’s inspection algorithms inspect thin wires, thick wires and ribbons with equal precision. Proven many times over, our system for 2D and 3D wire bond inspection can also be integrated in complex network environments.

• Targeted configuration: Maximum resolutions including height information
• Custom handling options
• Suitable for dual-track operation
• Camera modules for flexible application scenarios
• Unique analysis of bonding wires and ribbons in all common materials and strengths
• Integrated verification
• Scalable, modular camera technology and 3D measuring function