iS6059 THT Inspection

Unmatched 3D AOI for underside quality control

With innovative 3D camera technology, the iS6059 THT Inspection 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and at high precision on the underside of the printed circuit board. PCBAs as well as inspection objects on workpiece carriers are inspected at high speed in 2D, 2½D and 3D. As a result, the iS6059 THT Inspection stands for maximum defect detection and highest throughput. Different lighting can be used flexibly and so provide inspection results in excellent quality.

Maximum performance: Featuring a powerful 3D XM sensor system concept for performing quality inspections from below
First-rate inspection quality: Shadow-free inspection thanks to 8 angled cameras
System flexibility: reliable handling of a wide range of different inspection objects
Optimum process design due to extended handling possibilities such as long board option
Minimal time and training requirements thanks to Viscom standard software
Flexible integration into existing productions
Improved ergonomic design

Parameters and specifications

Camera resolution 13 µm
Dimensions 1100 × 1756 × 1753 mm (W × D × H)
Field of view (FOV) 50 × 50 mm
Z-axis measurement up to 30 mm
Inspection speed up to 65 cm²/s
Maximum PCB size 508 × 560 mm
Clearance up to 100 mm (top), 50 mm (bottom)

Václav Fiurášek Sales Manager
(AOI, Storage solutions)