iS6059 Dual-Lane Inspection

High-Speed System for Dual-Track Production

The iS6059 Dual Lane Variants Inspection combines the advantages of special high-speed 3D sensor technology with excellent inspection quality and extremely fast inspection speed. The 3D AOI system, which was developed for the economical large-scale production of assemblies, reliably inspects both components and solder joints. Within the manufacturing process, it can be intelligently networked for Industry 4.0 applications.

Inspection on two lanes at the same time
Any options you would get with the single lane equivalents are available here, as well
Robust system design
Verified zero defect slippage thanks to integrated verification
Flexible integration into existing productions
Improved ergonomic design

Parameters and specifications

Camera resolution 10 µm (AOI), 8 µm (optional), 12 µm (SPI)
Dimensions 1100 × 2006 × 1753 mm (W × D × H)
Field of view (FOV) 50 × 50 mm (AOI), 58 × 58 mm (SPI)
Z-axis measurement 30 mm (AOI), 5 mm (SPI)
Inspection speed up to 70 cm²/s (AOI), 80 cm²/s
Maximum PCB size 450 × 350 mm
Clearance 50 mm (top), 50 mm (bottom)

Václav Fiurášek Sales Manager
(AOI, Storage solutions)