iS6052 SPI

Reliable 3D solder and sinter paste inspection

Introducing the iS6052 SPI, Viscom's solution for inspecting solder paste applications in SMD production with remarkable efficiency and accuracy. Emerging from over forty years of expertise, this 3D inline system meticulously evaluates critical features like volume, height, and shape, alongside surface area, displacement, and smearing. Equipped with innovative sensor technology including an orthogonal camera and four lateral views, it ensures unparalleled inspection quality.

Realistic color imaging facilitates swift and precise verification, while the Fast Flow handling system guarantees exceptional throughput by synchronizing assembly input and output. With minimal handling times and reduced mechanical impact, this system optimizes efficiency without compromising performance. Intelligent networking capabilities further bolster process stability and streamline operations within the SMT line.

• Robust system design
• Ideal system configuration with respect to costs/benefits
• High inspection speed
• One orthogonal camera and four angled-view cameras provide basically shadow-free 3D inspections
• Verified zero defect slippage thanks to integrated verification
• Flexible integration into existing productions
• Improved ergonomic design