Phoenix V|tome|x S Neo

CT platform for high-resolution 2D radiography, 3D microCT, optional nanoCT® and dimensional measurement. It combines dual-tube flexibility, configurable detector performance and a compact footprint of just over 3 m² for seamless integration into laboratory and quality-control environments.

Phoenix V|tome|x S Neo is designed for applications ranging from fine-detail analysis of small parts to inspection of denser, medium-sized components. The system combines high-detail inspection, broad application flexibility and everyday usability in a compact industrial CT platform.

The Dual|tube configuration allows users to switch between a 240 kV / 320 W microfocus X-ray tube and an optional 180 kV / 20 W nanofocus X-ray tube with Diamond|window technology. Switching between penetration and precision is possible at the push of a button without recalibration.

With detail detectability below 1 µm with the microfocus tube and down to 0.2 µm with the optional nanofocus tube, V|tome|x S Neo supports demanding inspection applications in electronics, batteries, aerospace, medical devices, additive manufacturing and other industries.

The system offers a flexible detector lineup, allowing the configuration to be optimized for everyday inspection, higher throughput or high-resolution CT. Available detectors include the DXR S100 Pro, the fast Dynamic 41|200, and the high-resolution Dynamic 41|100 with 16 MP resolution, 100 µm pixel size and a dynamic range greater than 10,000:1.

Proprietary High|Flux target technology together with high-sensitivity detectors enables superior image quality at significantly reduced scan times. For larger parts, optional Offset|CT supports scan diameters up to 400 mm.

The optional Metrology|edition extends inspection into dimensional measurement according to VDI/VDE 2630. It supports nominal-actual CAD comparison, wall thickness analysis and reverse engineering, with verification using Ruby|plate and Easy|calib.

Data acquisition and reconstruction are handled by Datos|x 3, Waygate Technologies’ CT software platform. It provides an intuitive interface and up to 40% faster reconstruction, with advanced modules such as Fast|scan and Sector|scan for complex high-resolution inspection tasks.

Maximum voltage / power 240 kV / 320 W
Optional nanofocus X-ray tube 180 kV / 20 W with Diamond|window technology
Dual|tube configuration microfocus + nanofocus X-ray tube
Detail detectability – microfocus < 1 µm
Detail detectability – nanofocus down to 0.2 µm
Minimum voxel size – nanofocus < 0.27 µm
Maximum sample dimensions Ø 400 × 400 mm
Maximum 3D scan diameter with Offset|CT up to 400 mm
Maximum sample weight 10 kg, optional 15 kg
Supported inspection modes 2D radiography, 3D microCT, optional nanoCT® and dimensional CT metrology
TYPICAL APPLICATION
  • Electronics inspection
  • Hidden solder joint analysis
  • Voids and porosity inspection
  • Die attach integrity analysis
  • Wire bond alignment inspection
  • Battery inspection
  • Aerospace components
  • Medical devices
  • Additive manufacturing
  • Industrial dimensional metrology
  • Failure analysis
  • Research and development
Pavel Kubík Co-Owner, Sales Manager (RTG, CT, AOI)
phone
+420 571 669 311
email
p.kubik%a-t%pbt.cz

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