Solder Paste for reflow and vapor phase soldering
JEAN-151 is a ROL0 classified, halide-free, no-clean solder paste formulation with improved slump to prevent bridging and bead formation.
The standard alloy SAC305 is particularly suitable for the reflow process. With the standard alloy, JEAN-151 is the only printing paste available up to grain size 5. In addition, the silver-free, bismuth-containing solder SN100CV® is available for the highest reliability requirements. The alloys SN100C® and SCAN-Ge071 can also be used in the reflow process. Furthermore, the melting range of SCAN-Ge071 and SN100CV® alloys makes them ideal for use in the vapor phase to minimize tombstone effects.
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