The halogen-free activated No-Clean Flux EF270F with its medium activity completes perfectly the EasyFlux series. 

Using especially matching activators, this flux achieves very good wetting on various surfaces. It can be used for soldering with lead-free and lead containing alloys. The version EF270“F” is equipped with additives, to enable a safe and continuous foaming even on older foam fluxing units. This ensures a uniform flux film on the PCB and therefore a good soldering result.

The flux EF270F is an optimised version of the EF270, which can be used in foam fluxing units. It can be used in spray fluxers, too. Due to the used activator combination, a good wetting can be achieved on most surfaces in the electronics (e.g. OSP, Ni/Au, chem. Sn, HASL). Soldering can be done on nearly all available equipment (with or without nitrogen).

Product Advantages
  • No-Clean flux
  • Good wetting around and in through holes
  • Nearly no visible residues
  • High electrical safety of the residues
  • Developed for the application with foam fluxing units
  • Resin- and halide free formulation
  • No-clean application, electrically safe
  • Low residues
  • Resin-free
  • Optimised solid content – fast wetting
  • Perfect results with lead-free alloys
  • Optimized for foam fluxing application

Colour: colourless
Density at (20°C): 0.811 g/cm3
Flash point (closed crucible): 12°C
Ignition temperature: 425°C
Solid content: 2.7%
Acid rating: 25.0 mg KOH/g
Halide content: none
Thinner Stannol VD-500
David Pisárik Sales Manager
(soldering materials)
+420 725 404 124

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