The halogen-free, activated No-Clean Flux 500-17/1 shows a relatively high solid content.

 As a result, the flux is very well suited for tinning in a dip soldering process, e.g. enamelled copper wires.


The flux 500-17/1 has been specially developed for the dip soldering process. Due to the high solid content, it is very well suited for tinning enamelled copper wires. The flux and the solids also  withstand the higher temperatures well which are needed to  burn off the enamel. The solids still present after the immersion are sufficient to guarantee good wetting.

Colour:amber liquid
Density at (20°C): 0.828 g/cm3
Flash point (closed cup): 13°C
Ignition point: 425°C
Solid content: 15.0%
Acid rating: 53 mg KOH/g
Halide content: none
Corrosion: none DIN 8527 Type F-SW 32
Stannol VD-500
David Pisárik Sales Manager
(soldering materials)
+420 725 404 124

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