- Due to its wide process window ZESTRON® SW reliably removes solder pastes from the stencil underside
- Dries fast and residue-free on stencils after dry wipe
- Good delineation stability and reduced solder balling
- Unlike Isopropanol (flash point: 12°C/54°F) ZESTRON® SW (flash point: 67°C/153°F) dramatically increases operational safety while operating stencil printing equipment
- Based on non-halogen, organic solvents
- Biodegradable
- Reduces the amount of cleaning cycles
ApplicationStencil underside wiping in printers
ProcessSMT printer with or without vacuum drying
TechnologySolvent based