For the removal of solder pastes, SMT adhesives and thick film pastes

ZESTRON® SD 301 is an odor improved formulation. Especially a faster drying time allows for shorter cleaning processes. The solvent-based cleaner removes solder pastes, SMT adhesives as well as thick film pastes from stencils and screens in spray-in-air systems. Its high flash point permits both manual use and the application in printers and stencil cleaning equipment.
  • Wide process window
  • High loading capabilities, long bath life and therefore low cleaning costs
  • High flash point of 47° C / 117° F, can be used without external explosion-protection systems
  • Has a short overall process time
  • The cleaning medium is based on non-halogenated, organic solvents
  • Applicable at ambient cleaning temperature
  • Low odor as well as fast drying time
ApplicationStencil cleaning
ProcessExplosion-proof Spray-in-air system
TechnologySolvent based
Michal Šaffer Sales Manager
+420 724 026 675

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