- High bath loading capability of ZESTRON® FA+ ensures extended bath life
- The cleaning medium does not require any specific explosion-proof environment
- Due to the surfactant-free formulation, ZESTRON® FA+ can be easily rinsed
- Increased wire bonding/molding quality for power modules, leadframe-based discrete components and Power LEDs
- Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
- ZESTRON® FA+ has been EMPF Phase II tested and MIL approved
- This cleaning medium is listed in the ESA "list of declared materials"
Ultrasonic; Spray-under-immersion; Centrifugal cleaning