- Specifically designed for the use in dip tank systems
- Works exceptionally well for the cleaning in capillary spaces and is also suitable for cleaning under low standoff components
- Can be easily rinsed without leaving residues on the surface and provides low ionic contamination of cleaned parts
- Its high bath loading capacity ensures an extended bath life
- Has no flash point and does not require explosion proof equipment
- Ensures a void-free underfill by removing all tacky fluxes from Flip Chips/CMOS
- Improves the image resolution/reduces pixel defects due to particle removal from CMOS image sensors
ApplicationPCB cleaning/flux removal; Components with low standoff
ContaminationFlux residues
ProcessUltrasonic; Spray-under-immersion; Centrifugal cleaning
TechnologyMPC Technology; Water based