Stencil cleaner for the removal of solder pastes and SMT adhesives

VIGON® SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers.
  • High bath loading capability, very good filterability and therefore a long bath life as well as low maintenance costs
  • Recommended for ambient cleaning temperatures
  • Water-based cleaner without flash point, no explosion-proof protection required
  • Due to its mild formula, the medium shows excellent material compatibility with stencils
  • Applicable in closed-loop systems
  • No foaming when used in spray-in-air systems
  • Low odor, no building of organics in the rinsing section
ApplicationStencil cleaning; Stencil underside wiping
ProcessSpray-in-air; Ultrasonic; Underside wiping in printers
TechnologyMPC Technology
ContaminationSolder paste; SMT adhesives; Flux residues
Michal Šaffer Sales Manager
+420 724 026 675

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