- Successfully cleans under low standoff components
- Especially effective for lead-free No-Clean solder pastes
- High bath loading capacity ensures extended bath life, low maintenance costs and reduced costs per cleaned part
- Easy to rinse and does not leave any residues on the surfaces
- Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
- Optimal flux removal after die attach increases wire bonding quality as well as light conversion and life time of Power LEDs
ApplicationPCB defluxing, Components with low standoffs
ContaminationFlux residues
ProcessSpray-in-Air (Inline and Batch)
TechnologyMPC-Technology, Water-based