The water-based, halogen-free, low solid content Flux WF203 has been developed for reduction of the emission of easily volatile organic components (VOC).

With a suitable setting of the soldering machine for water-based flux, the amount of solids is sufficient to achieve good soldering results.

The Flux WF203 has been developed for industrial electronics manufacturing for soldering by wave soldering machines blanketed with air and nitrogen. Copper and also oxidised copper as well as all common protection layers (HAL, OSP, Ni/Au, chemical Sn and chemical Ag) show good wetting. The Flux WF203 also continues to ensure good filling of through-connections.

​Product Advantages
  • No-Clean - electrically safe residues
  • Non-combustible formulation
  • Substantially reduced number of solder beads
  • Good wetting and wicking
Colour: clear, colourless liquid
Solid content: 3,5%
Halide content: zero
Acid value (on liquid): 33.3 mg KOH g-1
Specific density at 25°C: 1.009 g/cm3
Recommended thinner: no thinner required
J-STD-004 classification: OR M0
DIN EN 29454-1: 2.1.3.A
David Pisárik obchodní zástupce (pájecí materiály)
+420 725 404 124

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