Na této stránce budeme postupně aktualizovat webináře našich dodavatelů.


Automatizace v tisku a aplikaci etiket (3)

12/05/2021, 10:00 - 11:00

Řečník: Richard Tomík

Seznamte se s ucelenou řadou profesionálních řešení Brady pro automatizaci tisku a aplikace etiket a značení kabelů
  • Tiskárny s aplikátorem etiket pro výrobní štítky
  • Tiskárny s aplikátorem laminovacích etiket pro značení kabeláže
  • Podavače etiket pro osazovací automaty – značení DPS

Tiskárny etiket Brady (1)

Téma I.: Tiskárny etiket Brady
10/05/2021, 13:00 - 14:00

Řečník: Eduard Knopek

Seznamte se s ucelenou řadou profesionálních tiskáren Brady pro tisk etiket, výrobních štítků, a průmyslového značení
  • Přenosné tiskárny Brady
  • Stolní tiskárny Brady
  • Software Brady pro připojení k PC
  • Servisní zajištění tiskáren

Spotřební materiály Brady (2)

11/05/2021, 10:00 - 11:00

Řečník: Eduard Knopek

Seznamte se s ucelenou řadou profesionálních materiálů Brady pro tisk etiket, výrobních štítků, a průmyslového značení
  • Materiály a etikety pro značení výrobků (výrobní, typové, identifikační štítky)
  • Materiály pro značení kabelů a vodičů (laminovací etikety, smršťovací bužírky, visačky)
  • Kombinace vhodné barvicí pásky a etikety
  • Vlastnosti materiálu, certifikace


Why Cleaning is Critical Before Conformal Coating  - March 23rd 

Join ZESTRON Academy for an informative discussion on the importance of cleaning PCBs in today’s production environments, focusing on cleaning before conformal coating. We will examine: the methods and benefits of fully cleaning PCBs, how coating over residues can result in product failures, cleanliness assessment methods used before conformal coating as well as the test methods used to assess their reliability afterward, and share expert process recommendations to ensure that your products perform as expected over the long-term.

DI-Water vs. Chemistry - April 27th  

In today’s PCB manufacturing environment, increased densities, reduced component sizes, low standoff heights, and a large variety of component packages combine to limit the effectiveness of cleaning with DI-water. Join ZESTRON Academy for an in-depth look at the cleaning agent technologies and process alternatives to pure DI-water.  We will examine key performance indicators including, cleanliness, material compatibility, power requirements, DI-water usage, and environmental impacts of using DI-water vs. chemistry.

Jet Printing and Cleaning Challenges   - May 25th 

Today’s production environments are overcoming printing challenges by incorporating jet printing as an additional add-on step to add extra solder paste volume when needed. Typically, jet printing pastes use Type 5 and 6 solder powder compared to type 3 and 4.  As cleaning remains critical to long-term reliability, jet solder pastes have proven more difficult to clean. Join ZESTRON Academy to explore the reasons behind the increased cleaning challenges with comparative cleaning trial data and customer case studies.


Surface Cleanliness: How Clean is Clean?  - June 22nd 

Often impurities left on a board’s surface or underneath components may lead to field failures. Join the experts at ZESTRON Academy for an in-depth review of the standardized and non-standardized test methods available to properly assess the cleanliness of assemblies after the cleaning process. Attend  this special webinar and discover the answer to a question we are so often asked – “How clean is clean?”.

Solder Mask and Low Stand-off Component Cleaning – A Connection?  - July 27th 

Please join ZESTRON Academy in exploring the impact of different solder mask options on under component cleanliness. The solder mask is necessary for the long-term reliability of PCBs, but can its presence also impact cleaning process effectiveness? Our cleaning experts will examine the latest findings and key takeaways from this recently prepared and presented study during this webinar.


Advanced Cleaning for Advanced Packages  - August 24th 

With increasing packaging densities and the introduction of new materials, join the experts at ZESTRON Academy to discuss overcoming present-day cleaning challenges associated with Class III Assemblies. Through a series of case studies, we will examine the complex component packages that are increasingly being used in the industry, their associated failure mechanisms, and discuss the factors to consider when selecting cleaning agents and optimizing your cleaning processes.

Improvements in Yield and Reliability for SMT Processes  - September 21st 

Attend ZESTRON Academy’s webinar for an in-depth review of the process-related issues to paste and adhesive contaminated stencils, stencil cleaning technologies as well as implications of cleaning nano-coated stencils. We will also explore the principles of the underside wipe process and review the topic of misprinted board cleaning.

Designing for Reliability in Class III Assemblies  - October 26th 

When designing high-reliability electronic assemblies, functionality is critical and long-term reliability is essential.  Join our webinar for a detailed overview of the various failure mechanisms including the challenges associated with improper cleaning, board complexity, material mix, component, and the package types used. Thru an in-depth case study examination, we will discuss the steps involved in reducing the risk of failures while improving long-term reliability.


Industrie 4.0: Connectivity and digital solutions


Datum: 12.5.2021, 14:30-15:30

The seminar covers the basic contents for connecting your Ersa systems to MES systems and the Kurtz Ersa CONNECT platform as well as advanced solutions such as assembly traceability and product carrier tracing.

Speaker: Nicolas Bartschat


Optical Inspection – Reduction of defects in electronic production

Datum: 2.6.2021, 10:00-11:00

  • Assistance instead of control
  • Influence of cleaning and calibration intervals on the test quality
  • ​​Defects detection  
  • Register online now

    Speaker: Marcel Buck

  • Waygate Technologies | Industrial X-ray imaging solutions | Webinar
    • Industrial X-ray 2D and CT has evolved to an established technology for defect detection as well as for metrology. In our seminar we introduce typical industrial application examples, provide an overview on state-of-the-art solutions and demonstrate technology highlights of industrial X-ray and CT inspection systems that also can be integrated in Brilliant Factories to enable their usage in fully automated mode for highest productivity.
  • Waygate Technologies | Metrology by CT | Webinar
    • With 3D printed and conventionally manufactured parts becoming more and more complex with a lot of hidden features, there is a growing demand for new measurement strategies. This webinar gives an introduction to the basics of metrology by CT and discusses the major factors that influence the metrological performance. We also present the technical solutions that are necessary to make CT measurements accurate and precise.

Společnost Vision Engineering se spojila s odborníky v oboru SMT, aby Vám přinesla sérii webinářů FREE Electronics Academy, které se podrobně věnují problémům, které mají vliv na montáž DPS. 

Většinu seminářů vede anglický expert na SMT Bob Willis, který se již léta věnuje problematice DPS. 

Učte se od odborníků. Dozvíte se mnoho informací k inspekci, jak identifikovat a odstranit závady, zlepšit kvalitu a snížit náklady.

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