Jet Printing and Cleaning Challenges - May 25th
Today’s production environments are overcoming printing challenges by incorporating jet printing as an additional add-on step to add extra solder paste volume when needed. Typically, jet printing pastes use Type 5 and 6 solder powder compared to type 3 and 4. As cleaning remains critical to long-term reliability, jet solder pastes have proven more difficult to clean. Join ZESTRON Academy to explore the reasons behind the increased cleaning challenges with comparative cleaning trial data and customer case studies.
Surface Cleanliness: How Clean is Clean? - June 22nd
Often impurities left on a board’s surface or underneath components may lead to field failures. Join the experts at ZESTRON Academy for an in-depth review of the standardized and non-standardized test methods available to properly assess the cleanliness of assemblies after the cleaning process. Attend this special webinar and discover the answer to a question we are so often asked – “How clean is clean?”.
Solder Mask and Low Stand-off Component Cleaning – A Connection? - July 27th
Please join ZESTRON Academy in exploring the impact of different solder mask options on under component cleanliness. The solder mask is necessary for the long-term reliability of PCBs, but can its presence also impact cleaning process effectiveness? Our cleaning experts will examine the latest findings and key takeaways from this recently prepared and presented study during this webinar.
Advanced Cleaning for Advanced Packages - August 24th
With increasing packaging densities and the introduction of new materials, join the experts at ZESTRON Academy to discuss overcoming present-day cleaning challenges associated with Class III Assemblies. Through a series of case studies, we will examine the complex component packages that are increasingly being used in the industry, their associated failure mechanisms, and discuss the factors to consider when selecting cleaning agents and optimizing your cleaning processes.
Improvements in Yield and Reliability for SMT Processes - September 21st
Attend ZESTRON Academy’s webinar for an in-depth review of the process-related issues to paste and adhesive contaminated stencils, stencil cleaning technologies as well as implications of cleaning nano-coated stencils. We will also explore the principles of the underside wipe process and review the topic of misprinted board cleaning.
Designing for Reliability in Class III Assemblies - October 26th
When designing high-reliability electronic assemblies, functionality is critical and long-term reliability is essential. Join our webinar for a detailed overview of the various failure mechanisms including the challenges associated with improper cleaning, board complexity, material mix, component, and the package types used. Thru an in-depth case study examination, we will discuss the steps involved in reducing the risk of failures while improving long-term reliability.